MCF5270CAB100 Freescale Semiconductor, MCF5270CAB100 Datasheet - Page 27

• Manufacturer Part Number: MCF5270CAB100
• Description: MCU V2 COLDFIRE 64K SRAM 160-QFP
• Manufacturer: Freescale Semiconductor
• Series: MCF527xr

Specifications of MCF5270CAB100

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number Of I /o: 39
• Program Memory Type: ROMless
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 160-QFP
• Processor Series: MCF527x
• Core: ColdFire V2
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: NNDK-MOD5272-KIT, NNDK-MOD5270-KIT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

About This Book
The primary objective of this reference manual is to define the functionality of the MCF5271
processor for use by software and hardware developers. In addition, this manual supports the
MCF5270. This book is written from the perspective of the MCF5271, and unless otherwise noted,
the information applies also to the MCF5270. The MCF5270 has the same functionality as the
MCF5271 and any differences in data regarding bus timing, signal behavior, and AC, DC, and
thermal characteristics are in the hardware specifications. Please refer to
Family Configurations,”
The information in this book is subject to change without notice, as described in the disclaimers
on the title page. As with any technical documentation, it is the reader’s responsibility to be sure
he is using the most recent version of the documentation.
To locate any published errata or updates for this document, refer to the world-wide web at
http://www.freescale.com/coldfire.
Audience
This manual is intended for system software and hardware developers and applications
programmers who want to develop products with the MCF5271. It is assumed that the reader
understands operating systems, microprocessor system design, basic principles of software and
hardware, and basic details of the ColdFire
Organization
Following is a summary and brief description of the major sections of this manual:
Freescale Semiconductor
•
•
•
•
Chapter 1,
incorporated in the MCF5271, focussing in particular on new features.
Chapter 2, “Signal
signals that characterizes each signal as an input or output, defines its state at reset, and
identifies whether a pull-up resistor should be used.
Chapter 3, “ColdFire
MCF5271. The chapter describes the organization of the Version 2 (V2) ColdFire processor
core and an overview of the program-visible registers (the programming model) as they are
implemented on the MCF5271.
Chapter 4, “Enhanced Multiply-Accumulate Unit
multiply/accumulate unit, which executes integer multiply, multiply-accumulate, and
miscellaneous register instructions. The EMAC is integrated into the operand execution
pipeline (OEP).
“Overview,” includes general descriptions of the modules and features
to see a summary of the differences.
Descriptions,” describes MCF5271 signals. It includes a listing of
Core,” provides an overview of the microprocessor core of the
MCF5271 Reference Manual, Rev. 2
®
architecture.
(EMAC),” describes the MCF5271
Section 1.1, “MCF5271
xxvii