MC56F8257MLH Freescale Semiconductor, MC56F8257MLH Datasheet - Page 625
MC56F8257MLH
Manufacturer Part Number
MC56F8257MLH
Description
DSC 64K FLASH 60MHZ 64-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr
Datasheets
1.TWR-56F8257.pdf
(88 pages)
2.MC56F8245VLD.pdf
(14 pages)
3.MC56F8245VLD.pdf
(2 pages)
4.MC56F8245VLD.pdf
(629 pages)
Specifications of MC56F8257MLH
Core Processor
56800E
Core Size
16-Bit
Speed
60MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
54
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Ram Size
4K x 16
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x12b, D/A 1x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
64-LQFP
Product
DSCs
Processor Series
56800E
Core
56800E
Device Million Instructions Per Second
60 MIPs
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
54
Data Ram Size
8 KB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC56F8257MLH
Manufacturer:
MOTOLOLA
Quantity:
560
Company:
Part Number:
MC56F8257MLH
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
- TWR-56F8257 PDF datasheet
- MC56F8245VLD PDF datasheet #2
- MC56F8245VLD PDF datasheet #3
- MC56F8245VLD PDF datasheet #4
- Current page: 625 of 629
- Download datasheet (4Mb)
21.4.2.3 TLM_SEL
The TLM_SEL instruction is a user-defined JTAG instruction, disabling the master TAP
and enabling the TAP linking module, or TLM. The TLM then selects the DSC core TAP
or the master TAP as the enabled TAP.
21.4.2.4 TAP Controller
The TAP controller is a synchronous 16-bit finite state machine illustrated in the
following figure. The TAP controller responds to changes at the TMS and TCK pins.
Transitions from one state to another occur on the rising edge of TCK. The value shown
adjacent to each state transition represents the signal present on TMS at the time of a
rising edge of TCK.
The TDO pin remains in the high impedance state except during the shift-DR and shift-IR
TAP controller states. In shift-DR and shift-IR controller states, TDO updates on the
falling edge of TCK. TDI is sampled on the rising edge of TCK.
The TAP controller executes the last instruction decoded until a new instruction is
entered at the update-IR state, or test-logic-reset is entered.
Freescale Semiconductor
0
1
Test-Logic-Reset F
Test-Logic-Reset F
0
Figure 21-3. TAP Controller State Diagram
MC56F825x/4x Reference Manual, Rev. 2, 10/2010
1
0 0
1
Select-DR-Scan 7
Preliminary
Capture-DR
Update-DR
Pause-DR
1
Exit1-DR
Exit2-DR
Shift-DR
0
0
1
0
1
1
0
6
2
1
3
0
5
0
0
1
1
Chapter 21 Joint Test Action Group (JTAG) Port
1
0
Select-iR-Scan 4
Capture-IR
Update-IR
Pause-IR
1
Exit1-IR
Exit2-IR
Shift-IR
0
0
1
0
1
1
0 0
E
A
9
B
8
D
0
0
1
625
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