MC56F8257MLH Freescale Semiconductor, MC56F8257MLH Datasheet - Page 530

DSC 64K FLASH 60MHZ 64-LQFP

MC56F8257MLH

Manufacturer Part Number
MC56F8257MLH
Description
DSC 64K FLASH 60MHZ 64-LQFP
Manufacturer
Freescale Semiconductor
Series
56F8xxxr

Specifications of MC56F8257MLH

Core Processor
56800E
Core Size
16-Bit
Speed
60MHz
Connectivity
CAN, I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
54
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Ram Size
4K x 16
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x12b, D/A 1x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
64-LQFP
Product
DSCs
Processor Series
56800E
Core
56800E
Device Million Instructions Per Second
60 MIPs
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
54
Data Ram Size
8 KB
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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MC56F8257MLH
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Part Number:
MC56F8257MLH
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Functional Description
530
External Clock Source
External Clock Source
Clock Source
Crystal
Table 15-10. Clock Choices with Crystal Oscillator (continued)
Clock Selected Configuration Steps
MC56F825x/4x Reference Manual, Rev. 2, 10/2010
Postscaler
Postscaler
Direct
10. Change ZSRC to select the postscaler clock (ZSRC=10).
10. Change ZSRC to select the postscaler clock (ZSRC=10).
11. At this point the EXTAL pin can be used as a GPIO by deasserting
1. The crystal oscillator should be powered up (CLK_MODE=0).
2. Change the oscillator to low power mode (COHL=1)
3. Wait for the crystal oscillator to stabilize (up to 10ms)
4. The clock source should be changed to the crystal oscillator
5. Wait 6 NOP's for the synchronizing circuit to change clocks.
6. The relaxation oscillator can be powered down (ROPD=1) to con‐
7. Change COD, if desired
8. Enable the PLL (PLLPD=0)
9. Wait for PLL lock (LCK1=1 and LCK0=1)
1. The clock source (CLKIN) should be enabled in the GPIO and SIM
2. Set the CLK_MODE bit in OSCTL register to 1.
3. Select CLKIN as the source clock (PRECS=1).
4. The clock source should be changed to the crystal oscillator
5. Wait 6 NOP's for the synchronizing circuit to change clocks.
6. The relaxation oscillator can be powered down (ROPD=1) to con‐
7. At this point the EXTAL pin can be used as a GPIO by deasserting
1. The clock source (CLKIN) should be enabled in the GPIO and SIM
2. Set the CLK_MODE bit in OSCTL register to 1.
3. Select CLKIN as the source clock (PRECS=1).
4. The clock source should be changed to the crystal oscillator
5. Wait x NOP's for the synchronizing circuit to change clocks.
6. The relaxation oscillator can be powered down (ROPD=1) to con‐
7. Change COD, if desired
8. Enable the PLL (PLLPD=0)
9. Wait for PLL lock (LCK1=1 and LCK0=1)
Preliminary
(EXT_SEL=0, PRECS=1, in that order)
serve power
as necessary.(Chip dependent)
(EXT_SEL=1, PRECS=1, in that order).
serve power.
the appropriate PE bit in the GPIO_X_PER.
as necessary.(Chip dependent)
(EXT_SEL=1, PRECS=1, in that order)
serve power
the appropriate PE bit in the GPIO_X_PER.
Freescale Semiconductor

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