R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 336

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R4F24278NVFQU

Manufacturer Part Number
R4F24278NVFQU
Description
MCU 512K/48K 2.7-5.5V 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet

Specifications of R4F24278NVFQU

Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
98
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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R4F24278NVFQU
Manufacturer:
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Section 7 Bus Controller (BSC)
(b) Normal space access after a continuous synchronous DRAM space write access
If a normal space read cycle occurs after a continuous synchronous DRAM space write access
while the ICIS2 bit is set to 1 in BCR, idle cycle is inserted at the start of the read cycle. The
number of states of the idle cycle to be inserted is in accordance with the setting of bit IDLC. It is
not in accordance with the DRMI bit in DRACCR.
Figure 7.92 shows an example of idle cycle operation when the ICIS2 bit is set to 1.
Page 306 of 1448
Figure 7.92 Example of Idle Cycle Operation after Continuous Synchronous DRAM Space
Precharge-sel
DQMU, DQML
Address bus
HWR, LWR
Data bus
CKE
CAS
RAS
WE
RD
φ
Write Access (IDLC = 0, ICIS1 = 0, SDWCD = 1, CAS Latency 2)
address 1
PALL ACTV
Column
T
Continuous synchronous
DRAM space write
p
address
address
Row
Row
T
r
Column address 1
NOP WRIT
T
c1
T
c2
Idle cycle
T
i
External address
External address
External space read
T
1
High
NOP
T
2
H8S/2427, H8S/2427R, H8S/2425 Group
T
3
READ
Column address 2
Synchronous
DRAM space read
T
REJ09B0565-0100 Rev. 1.00
c1
T
Cl
NOP
T
c2
Jul 22, 2010

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