R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 1269

• Manufacturer Part Number: R4F24278NVFQU
• Description: MCU 512K/48K 2.7-5.5V 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2400r

Specifications of R4F24278NVFQU

• Core Processor: H8S/2600
• Core Size: 16/32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 98
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

H8S/2427, H8S/2427R, H8S/2425 Group
26.5.6
The following points should be noted in clock division mode.
• Select the clock division ratio by the STC1 and STC0 bits so that the frequency of φ is within
• All the on-chip peripheral modules operate on the φ. Therefore, note that the time processing
• Note that the frequency of φ will be changed by changing the clock division ratio.
REJ09B0565-0100 Rev. 1.00
Jul 22, 2010
the operation guaranteed range of clock cycle time t
In other words, the frequency of φ must be 8 MHz or higher; be careful not so specify φ < 8
MHz.
of modules such as a timer and SCI differ before and after changing the clock division ratio. In
addition, the wait time for clearing software standby mode differs by changing the clock
division ratio.
Notes on Clock Division Mode
cyc
shown in the Electrical Characteristics.
Section 26 Power-Down Modes
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