R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 29

• Manufacturer Part Number: R4F24278NVFQU
• Description: MCU 512K/48K 2.7-5.5V 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2400r

Specifications of R4F24278NVFQU

• Core Processor: H8S/2600
• Core Size: 16/32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 98
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

26.2 Operation ......................................................................................................................... 1228
26.3 φ Clock Output Control.................................................................................................... 1236
26.4 SDRAMφ Clock Output Control ..................................................................................... 1237
26.5 Usage Notes ..................................................................................................................... 1238
Section 27 List of Registers .............................................................................1241
27.1 Register Addresses (Address Order)................................................................................ 1242
27.2 Register Bits..................................................................................................................... 1259
27.3 Register States in Each Operating Mode ......................................................................... 1281
Section 28 Electrical Characteristics ...............................................................1299
28.1 Electrical Characteristics for H8S/2427 Group
28.2 Electrical Characteristics for H8S/2425 Group (3-V Version) ........................................ 1316
26.1.3 Extension Module Stop Control Registers H and L
26.1.4 RAM Module Stop Control Registers H and L
26.2.1 Clock Division Mode.......................................................................................... 1228
26.2.2 Sleep Mode ......................................................................................................... 1229
26.2.3 Software Standby Mode...................................................................................... 1230
26.2.4 Hardware Standby Mode .................................................................................... 1233
26.2.5 Module Stop Function ........................................................................................ 1234
26.2.6 All Module Clocks Stop Mode ........................................................................... 1235
26.5.1 I/O Port Status..................................................................................................... 1238
26.5.2 Current Dissipation during Oscillation Stabilization Standby Period................. 1238
26.5.3 EXDMAC, DMAC, and DTC Module Stop....................................................... 1238
26.5.4 On-Chip Peripheral Module Interrupts ............................................................... 1238
26.5.5 Writing to MSTPCR, EXMSTPCR, and RMMSTPCR...................................... 1238
26.5.6 Notes on Clock Division Mode........................................................................... 1239
and H8S/2427R Group (3-V Version) ............................................................................. 1299
28.1.1 Absolute Maximum Ratings ............................................................................... 1299
28.1.2 DC Characteristics .............................................................................................. 1300
28.1.3 AC Characteristics .............................................................................................. 1304
28.1.4 A/D Conversion Characteristics ......................................................................... 1314
28.1.5 D/A Conversion Characteristics ......................................................................... 1314
28.1.6 Flash Memory Characteristics ............................................................................ 1315
28.2.1 Absolute Maximum Ratings ............................................................................... 1316
28.2.2 DC Characteristics .............................................................................................. 1317
28.2.3 AC Characteristics .............................................................................................. 1321
28.2.4 A/D Conversion Characteristics ......................................................................... 1329
(EXMSTPCRH, EXMSTPCRL) ........................................................................ 1225
(RMMSTPCRH, RMMSTPCRL)....................................................................... 1226
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