R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 291

• Manufacturer Part Number: R4F24278NVFQU
• Description: MCU 512K/48K 2.7-5.5V 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2400r

Specifications of R4F24278NVFQU

• Core Processor: H8S/2600
• Core Size: 16/32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 98
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

H8S/2427, H8S/2427R, H8S/2425 Group
7.8.7
CAS latency is controlled by settings of the W22 to W20 bits of WTCRB. Set the CAS latency
count, as shown in table 7.11, by the setting of synchronous DRAM. Depending on the setting, the
CAS latency control cycle (T
AST2 bit of ASTCR. Figure 7.57 shows the CAS latency control timing when synchronous
DRAM of CAS latency 3 is connected.
The initial value of W22 to W20 is H'7. Set the register according to the CAS latency of
synchronous DRAM to be connected.
Table 7.11 Setting CAS Latency
REJ09B0565-0100 Rev. 1.00
Jul 22, 2010
W22
0
1
CAS Latency Control
W21
0
1
0
1
W20
0
1
0
1
0
1
0
1
c1
) is inserted. WTCRB can be set regardless of the setting of the
Description
Connect synchronous DRAM of CAS
latency 1
Connect synchronous DRAM of CAS
latency 2
Connect synchronous DRAM of CAS
latency 3
Connect synchronous DRAM of CAS
latency 4
Reserved (must not be used)
Reserved (must not be used)
Reserved (must not be used)
Reserved (must not be used)
CAS Latency Control
Cycle Inserted
0 state
1 state
2 states
3 states
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⎯
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Section 7 Bus Controller (BSC)
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