R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 287

• Manufacturer Part Number: R4F24278NVFQU
• Description: MCU 512K/48K 2.7-5.5V 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2400r

Specifications of R4F24278NVFQU

• Core Processor: H8S/2600
• Core Size: 16/32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 98
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

H8S/2427, H8S/2427R, H8S/2425 Group
7.8.3
If the ABW2 bit in ABWCR corresponding to an area designated as continuous synchronous
DRAM space is set to 1, areas 2 to 5 are designated as 8-bit continuous synchronous DRAM
space; if the bit is cleared to 0, the areas are designated as 16-bit continuous synchronous DRAM
space. In 16-bit continuous synchronous DRAM space, ×16-bit configuration synchronous DRAM
can be connected directly.
In 8-bit continuous synchronous DRAM space the upper half of the data bus, D15 to D8, is
enabled, while in 16-bit continuous synchronous DRAM space both the upper and lower halves of
the data bus, D15 to D0, are enabled.
Access sizes and data alignment are the same as for the basic bus interface: see section 7.5.1, Data
Size and Data Alignment.
7.8.4
Table 7.10 shows pins used for the synchronous DRAM interface and their functions.
Set the OEE bit in DRAMCR to 1 when the CKE signal is output.
REJ09B0565-0100 Rev. 1.00
Jul 22, 2010
Data Bus
Pins Used for Synchronous DRAM Interface
Section 7 Bus Controller (BSC)
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