R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 1246

• Manufacturer Part Number: R4F24278NVFQU
• Description: MCU 512K/48K 2.7-5.5V 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2400r

Specifications of R4F24278NVFQU

• Core Processor: H8S/2600
• Core Size: 16/32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 98
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Section 25 Clock Pulse Generator
25.4.3
When using the crystal resonator, place the crystal resonator and its load capacitors as close as
possible to the XTAL and EXTAL pins. Other signal lines should be routed away from the
oscillation circuit to prevent induction from interfering with correct oscillation. See figure 25.6.
Figure 25.7 shows the external circuitry recommended for the PLL circuit. Separate PLLVcc and
PLLVss from the other Vcc and Vss lines at the board power supply source, and be sure to insert
bypass capacitors CPB and CB close to the pins.
Page 1216 of 1448
Notes on Board Design
Note: * CB and CPB are laminated ceramic capacitors.
Figure 25.7 Recommended External Circuitry for PLL Circuit
Prohibited
Figure 25.6 Note on Board Design for Oscillation Circuit
PLLV
C
C
PLLV
L2
L1
V
V
CC
CC
SS
SS
Signal A Signal B
CPB: 0.1 µF *
CB: 0.1 µF *
XTAL
EXTAL
This LSI
H8S/2427, H8S/2427R, H8S/2425 Group
REJ09B0565-0100 Rev. 1.00
Jul 22, 2010