R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 273

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R4F24278NVFQU

Manufacturer Part Number
R4F24278NVFQU
Description
MCU 512K/48K 2.7-5.5V 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet

Specifications of R4F24278NVFQU

Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
98
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
R4F24278NVFQU
Manufacturer:
REALTEK
Quantity:
2 300
Part Number:
R4F24278NVFQU
Manufacturer:
Renesas Electronics America
Quantity:
10 000
H8S/2427, H8S/2427R, H8S/2425 Group
REJ09B0565-0100 Rev. 1.00
Jul 22, 2010
φ
Address bus
RASn (CSn)
UCAS, LCAS
RD
OE
Data bus
Note: n = 2 to 5
Note, however, that the RAS signal will go high if:
⎯ a refresh operation is initiated in the RAS down state
⎯ self-refreshing is performed
⎯ the chip enters software standby mode
⎯ the external bus is released
⎯ the RCDM bit or BE bit is cleared to 0
If a transition is made to the all-module-clocks-stopped mode in the RAS down state, the clock
will stop with RAS low. To enter the all-module-clocks-stopped mode with RAS high, the
RCDM bit must be cleared to 0 before executing the SLEEP instruction.
Figure 7.44 Example of Operation Timing in RAS Down Mode
T
Row address
p
DRAM space read
T
r
(RAST = 0, CAST = 0)
Column address 1
T
c1
T
c2
External address
Normal space
T
1
read
T
2
Section 7 Bus Controller (BSC)
Column address 2
DRAM space
T
c1
read
Page 243 of 1448
T
c2

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