TMPR4937XBG-300 Toshiba, TMPR4937XBG-300 Datasheet - Page 21

• Manufacturer Part Number: TMPR4937XBG-300
• Manufacturer: Toshiba

Specifications of TMPR4937XBG-300

• Family Name: TX49
• Device Core Size: 64b
• Frequency (max): 300MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.5V
• Operating Supply Voltage (max): 1.6V
• Operating Supply Voltage (min): 1.4V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 484
• Package Type: BGA
• Lead Free Status / Rohs Status: Compliant

2.2
2.2.1
2.2.2
Never touch a power device while it is powered on. Also, after turning off a power device, do not touch it until it has thoroughly
discharged all remaining electrical charge.
Touching a power device while it is powered on or still charged could cause a severe electric shock, resulting in death or serious
injury.
When conducting any kind of evaluation, inspection or testing, be sure to connect the testing equipment’s electrodes or probes to
the device under test before powering it on.
When you have finished, discharge any electrical charge remaining in the device.
Connecting the electrodes or probes of testing equipment to a device while it is powered on may result in electric shock, causing
injury.
When a visible semiconductor laser is operating, do not look directly into the laser beam or look through the optical system.
This is highly likely to impair vision, and in the worst case may cause blindness.
If it is necessary to examine the laser apparatus, for example to inspect its optical characteristics, always wear the appropriate
type of laser protective glasses as stipulated by IEC standard IEC825-1.
Ensure that the current flowing in an LED device does not exceed the device’s maximum rated current.
This is particularly important for resin-packaged LED devices, as excessive current may cause the package resin to blow up,
scattering resin fragments and causing injury.
When testing the dielectric strength of a photocoupler, use testing equipment which can shut off the supply voltage to the
photocoupler. If you detect a leakage current of more than 100 µA, use the testing equipment to shut off the photocoupler’s
supply voltage; otherwise a large short-circuit current will flow continuously, and the device may break down or burst into
flames, resulting in fire or injury.
When incorporating a visible semiconductor laser into a design, use the device’s internal photodetector or a separate
photodetector to stabilize the laser’s radiant power so as to ensure that laser beams exceeding the laser’s rated radiant power
cannot be emitted.
If this stabilizing mechanism does not work and the rated radiant power is exceeded, the device may break down or the
excessively powerful laser beams may cause injury.
Precautions Specific to Each Product Group
Optical semiconductor devices
Power devices
2-3
2 Safety Precautions