TMPR4937XBG-300 Toshiba, TMPR4937XBG-300 Datasheet - Page 154

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TMPR4937XBG-300

Manufacturer Part Number
TMPR4937XBG-300
Description
Manufacturer
Toshiba
Datasheet

Specifications of TMPR4937XBG-300

Family Name
TX49
Device Core Size
64b
Frequency (max)
300MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.5V
Operating Supply Voltage (max)
1.6V
Operating Supply Voltage (min)
1.4V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
484
Package Type
BGA
Lead Free Status / Rohs Status
Compliant

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7.6
Flash ROM, SRAM Usage Example
connections. Also, Figure 7.6.3 illustrates example connections with the SDRAM and the bus separated.
load, 100 MHz class high-speed SDRAM access may not be performed normally. As a corrective measure,
there is a way of reducing the bus load by connecting a device other than SDRAM via a buffer. If such a
method is employed, directional control becomes necessary since the data becomes bidirectional.
BUSSPRT* is asserted when the External Bus Controller channel is active and a Read operation is being
performed.
Figure 7.6.1 illustrates example Flash ROM connections, and Figure 7.6.2 illustrates example SRAM
Since connecting multiple memory devices such as SDRAM and ROM onto a single bus increases the
The TX4937 prepares the BUSSPRT* signal for performing data directional control (see Figure 7.6.3).
ADDR[19:0]
TX4937
DATA[31:0]
Figure 7.6.1 Flash ROM (x16 Bits) Connection Example (32-bit Data Bus)
BWE*[3:0]
Figure 7.6.2 SRAM (x16 Bits) Connection Example (32-bit Data Bus)
CE*[1]
SWE*
OE*
ADDR[19:0]
TX4937
DATA[31:0]
CE*[0]
SWE*
ACE*
OE*
ADDR[12]
ADDR[19:0]
ADDR[19:0]
(ADDR[20])
7-54
A[19:0]
CS*
WE*
OE*
UB
BWE*[3]
Chapter 7 External Bus Controller
D[15:0]
A[19:0]
A20
CE*
WE*
OE*
D[15:0]
Flash ROM (x16 bits)
D[31:16]
LB
D[31:16]
BWE*[2]
SRAM (x16 Bits)
A[19:0]
CS*
WE*
OE*
A[19:0]
A20
CE*
WE*
OE*
UB
D[15:0]
BWE*[1]
D[15:0]
D[15:0]
D[15:0]
LB
BWE*[0]

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