NH82801GR S L8FY Intel, NH82801GR S L8FY Datasheet - Page 202

• Manufacturer Part Number: NH82801GR S L8FY
• Manufacturer: Intel

Specifications of NH82801GR S L8FY

• Lead Free Status / RoHS Status: Compliant

11.3
Figure 11-3. MCH Package Dimensions (Top View)
Figure 11-4. MCH Package Dimensions (Side View)
202
Package
The MCH package measures 34 mm × 34 mm; it is a 34 mm squared, 6-layer flip chip
ball grid array (FC-BGA) package. The 1202 balls are located in a non-grid pattern.
Figure 11-3
further information on the package, see the Intel® 3000 and 3010 Chipset Memory
Controller Hub (MCH) Thermal/Mechanical Design Guide.
The chipset has lead-free MCH only.
Note: All dimensions are in millimeters.
2.355 ± 0.082 mm
Notes:
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)
2. All dimensions and tolerances conform to ANSI Y14.5M-1994
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave
(bowl shaped) orientation after reflow
1.92 ± 0.078 mm
through
0.435 ± 0.025 mm
See note 3
Handling Exclusion
Capacitor Area,
17.15
Zone
Handling Area
Figure 11-5
Substrate
Decoup
10.13
Cap
0.84 ± 0.05 mm
Intel® 3000 and 3010 Chipset Memory Controller Hub (MCH) Datasheet
show the physical dimensions of the package. For
16.33
34.00
8.44
MCH
Die
3.95
Seating Plane
Die
0.7 mm Max
3.0
2.0
Ballout and Package Information
Keepout
Area
Die
Ø5.20mm
34.00
0.20 See note 4.
See note 1.
0.20
–C–