AT32UC3A364-ALUT Atmel, AT32UC3A364-ALUT Datasheet - Page 226

• Manufacturer Part Number: AT32UC3A364-ALUT
• Description: IC MCU 64KB FLASH 144LQFP
• Manufacturer: Atmel
• Series: AVR®32 UC3r

Specifications of AT32UC3A364-ALUT

• Core Processor: AVR
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: EBI/EMI, I²C, IrDA, MMC, SPI, SSC, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
• Number Of I /o: 110
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: AT32UC3x
• Core: AVR32
• Data Bus Width: 32 bit
• Data Ram Size: 96 KB
• Interface Type: IrDA/SCI/SCIF/UDI
• Maximum Clock Frequency: 66 MHz
• Number Of Timers: 3
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR32, EWAVR32-BL, KSK-EVK1100-PL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATEXTWIFI, ATEVK1104
• Minimum Operating Temperature: - 40 C
• Controller Family/series: AT32UC3A
• No. Of I/o's: 110
• Ram Memory Size: 64KB
• Cpu Speed: 66MHz
• No. Of Timers: 2
• Rohs Compliant: Yes
• For Use With: ATEVK1104 - KIT DEV/EVAL FOR AVR32 AT32UC3AATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATEVK1100 - KIT DEV/EVAL FOR AVR32 AT32UC3A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Figure 16-7. Refresh Cycle Followed by a Read Access
16.7.6
16.7.6.1
32072C–AVR32–2010/03
SDRAMC_A[12:0]
D[15:0]
NCS[1]
(input)
SDWE
SDCK
RAS
CAS
Power Management
Self refresh mode
Row n
Col c Col d
Dnb
Dnc
Three low power modes are available:
The SDRAMC activates one low power mode as soon as the SDRAM device is not selected. It is
possible to delay the entry in self refresh and power-down mode after the last access by config-
uring the Timeout field in the Low Power Register (LPR.TIMEOUT).
This mode is selected by writing the value one to the Low Power Configuration Bits field in the
SDRAMC Low Power Register (LPR.LPCB). In self refresh mode, the SDRAM device retains
data without external clocking and provides its own internal clocking, thus performing its own
auto refresh cycles. All the inputs to the SDRAM device become “don’t care” except SDCKE,
which remains low. As soon as the SDRAM device is selected, the SDRAMC provides a
sequence of commands and exits self refresh mode.
Some low power SDRAMs (e.g., mobile SDRAM) can refresh only one quarter or a half quarter
or all banks of the SDRAM array. This feature reduces the self refresh current. To configure this
feature, Temperature Compensated Self Refresh (TCSR), Partial Array Self Refresh (PASR)
• Self refresh mode: the SDRAM executes its own auto refresh cycles without control of the
• Power-down mode: auto refresh cycles are controlled by the SDRAMC. Between auto refresh
• Deep power-down mode (only available with mobile SDRAM): the SDRAM contents are lost,
Dnd
SDRAMC. Current drained by the SDRAM is very low.
cycles, the SDRAM is in power-down. Current drained in power-down mode is higher than in
self refresh mode.
but the SDRAM does not drain any current.
t
RP
= 3
t
RC
= 8
Row m
AT32UC3A3/A4
t
RCD
= 3
Col a
CAS = 2
Dma
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