AT32UC3A364-ALUT Atmel, AT32UC3A364-ALUT Datasheet - Page 223

IC MCU 64KB FLASH 144LQFP

AT32UC3A364-ALUT

Manufacturer Part Number
AT32UC3A364-ALUT
Description
IC MCU 64KB FLASH 144LQFP
Manufacturer
Atmel
Series
AVR®32 UC3r
Datasheets

Specifications of AT32UC3A364-ALUT

Core Processor
AVR
Core Size
32-Bit
Speed
66MHz
Connectivity
EBI/EMI, I²C, IrDA, MMC, SPI, SSC, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, WDT
Number Of I /o
110
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
AT32UC3x
Core
AVR32
Data Bus Width
32 bit
Data Ram Size
96 KB
Interface Type
IrDA/SCI/SCIF/UDI
Maximum Clock Frequency
66 MHz
Number Of Timers
3
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR32, EWAVR32-BL, KSK-EVK1100-PL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATEXTWIFI, ATEVK1104
Minimum Operating Temperature
- 40 C
Controller Family/series
AT32UC3A
No. Of I/o's
110
Ram Memory Size
64KB
Cpu Speed
66MHz
No. Of Timers
2
Rohs Compliant
Yes
For Use With
ATEVK1104 - KIT DEV/EVAL FOR AVR32 AT32UC3AATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATEVK1100 - KIT DEV/EVAL FOR AVR32 AT32UC3A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT32UC3A364-ALUT
Manufacturer:
Atmel
Quantity:
10 000
Figure 16-4. Write Burst, 16-bit SDRAM Access
16.7.3
32072C–AVR32–2010/03
SDRAMC_A[12:0]
D[15:0]
NCS[1]
SDWE
SDCK
SDRAM Controller Read Cycle
RAS
CAS
The SDRAMC allows burst access, incremental burst of unspecified length or single access. In
all cases, the SDRAMC keeps track of the active row in each bank, thus maximizing perfor-
mance of the SDRAM. If row and bank addresses do not match the previous row/bank address,
then the SDRAMC automatically generates a precharge command, activates the new row and
starts the read command. To comply with the SDRAM timing parameters, additional clock cycles
on SDCK are inserted between precharge and active (t
read (t
read command, additional wait states are generated to comply with the CAS latency (one, two,
or three clock delays specified in the CR register).
For a single access or an incremented burst of unspecified length, the SDRAMC anticipates the
next access. While the last value of the column is returned by the SDRAMC on the bus, the
SDRAMC anticipates the read to the next column and thus anticipates the CAS latency. This
reduces the effect of the CAS latency on the internal bus.
For burst access of specified length (4, 8, 16 words), access is not anticipated. This case leads
to the best performance. If the burst is broken (border, busy mode, etc.), the next access is han-
dled as an incrementing burst of unspecified length.
Row n
t
RCD
RCD
= 3
) commands. These two parameters are set in the CR register of the SDRAMC. After a
Col a
Dna
Col b
Dnb
Col c
Dnc
Col d
Dnd
Col e
Dne
Col f
Dnf
Col g
Dng
RP
) commands and between active and
Col h Col i
Dnh
AT32UC3A3/A4
Dni
Col j
Dnj
Col k
Dnk
Col l
Dnl
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