AT32UC3A364-ALUT Atmel, AT32UC3A364-ALUT Datasheet - Page 217

• Manufacturer Part Number: AT32UC3A364-ALUT
• Description: IC MCU 64KB FLASH 144LQFP
• Manufacturer: Atmel
• Series: AVR®32 UC3r

Specifications of AT32UC3A364-ALUT

• Core Processor: AVR
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: EBI/EMI, I²C, IrDA, MMC, SPI, SSC, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
• Number Of I /o: 110
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: AT32UC3x
• Core: AVR32
• Data Bus Width: 32 bit
• Data Ram Size: 96 KB
• Interface Type: IrDA/SCI/SCIF/UDI
• Maximum Clock Frequency: 66 MHz
• Number Of Timers: 3
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWAVR32, EWAVR32-BL, KSK-EVK1100-PL
• Development Tools By Supplier: ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATEXTWIFI, ATEVK1104
• Minimum Operating Temperature: - 40 C
• Controller Family/series: AT32UC3A
• No. Of I/o's: 110
• Ram Memory Size: 64KB
• Cpu Speed: 66MHz
• No. Of Timers: 2
• Rohs Compliant: Yes
• For Use With: ATEVK1104 - KIT DEV/EVAL FOR AVR32 AT32UC3AATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATEVK1100 - KIT DEV/EVAL FOR AVR32 AT32UC3A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

16. SDRAM Controller (SDRAMC)
16.1
16.2
32072C–AVR32–2010/03
Features
Overview
Rev: 2.2.0.3
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The SDRAM Controller (SDRAMC) extends the memory capabilities of a chip by providing the
interface to an external 16-bit SDRAM device. The page size supports ranges from 2048 to 8192
and the number of columns from 256 to 2048. It supports byte (8-bit) and halfword (16-bit)
accesses.
The SDRAMC supports a read or write burst length of one location. It keeps track of the active
row in each bank, thus maximizing SDRAM performance, e.g., the application may be placed in
one bank and data in the other banks. So as to optimize performance, it is advisable to avoid
accessing different rows in the same bank.
The SDRAMC supports a CAS latency of one, two, or three and optimizes the read access
depending on the frequency.
The different modes available (self refresh, power-down, and deep power-down modes) mini-
mize power consumption on the SDRAM device.
128-Mbytes address space
Numerous configurations supported
Programming facilities
Energy-saving capabilities
Error detection
SDRAM power-up initialization by software
CAS latency of one, two, and three supported
Auto Precharge command not used
– 2K, 4K, 8K row address memory parts
– SDRAM with two or four internal banks
– SDRAM with 16-bit data path
– Word, halfword, byte access
– Automatic page break when memory boundary has been reached
– Multibank ping-pong access
– Timing parameters specified by software
– Automatic refresh operation, refresh rate is programmable
– Automatic update of DS, TCR and PASR parameters (mobile SDRAM devices)
– Self-refresh, power-down, and deep power-down modes supported
– Supports mobile SDRAM devices
– Refresh error interrupt
AT32UC3A3/A4
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