AT32UC3A364-ALUT Atmel, AT32UC3A364-ALUT Datasheet - Page 197

IC MCU 64KB FLASH 144LQFP

AT32UC3A364-ALUT

Manufacturer Part Number
AT32UC3A364-ALUT
Description
IC MCU 64KB FLASH 144LQFP
Manufacturer
Atmel
Series
AVR®32 UC3r
Datasheets

Specifications of AT32UC3A364-ALUT

Core Processor
AVR
Core Size
32-Bit
Speed
66MHz
Connectivity
EBI/EMI, I²C, IrDA, MMC, SPI, SSC, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, POR, WDT
Number Of I /o
110
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
AT32UC3x
Core
AVR32
Data Bus Width
32 bit
Data Ram Size
96 KB
Interface Type
IrDA/SCI/SCIF/UDI
Maximum Clock Frequency
66 MHz
Number Of Timers
3
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWAVR32, EWAVR32-BL, KSK-EVK1100-PL
Development Tools By Supplier
ATAVRDRAGON, ATSTK500, ATSTK600, ATAVRISP2, ATAVRONEKIT, ATEXTWIFI, ATEVK1104
Minimum Operating Temperature
- 40 C
Controller Family/series
AT32UC3A
No. Of I/o's
110
Ram Memory Size
64KB
Cpu Speed
66MHz
No. Of Timers
2
Rohs Compliant
Yes
For Use With
ATEVK1104 - KIT DEV/EVAL FOR AVR32 AT32UC3AATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATEVK1100 - KIT DEV/EVAL FOR AVR32 AT32UC3A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT32UC3A364-ALUT
Manufacturer:
Atmel
Quantity:
10 000
15.6.6.2
Figure 15-21. TDF Optimization: No TDF Wait States Are Inserted if the TDF Period Is over when the Next Access Begins
15.6.6.3
32072C–AVR32–2010/03
A[AD_MSB:2]
CLK_SMC
D[15:0]
NCS0
NWE
NRD
TDF optimization enabled (MODE.TDFMODE = 1)
TDF optimization disabled (MODE.TDFMODE = 0)
Read access on NCS0 (NRD controlled)
When the MODE.TDFMODE bit is written to one (TDF optimization is enabled), the SMC takes
advantage of the setup period of the next access to optimize the number of wait states cycle to
insert.
Figure 15-21 on page 197
controlled by NWE, on Chip Select 0. Chip Select 0 has been programmed with:
NRDHOLD = 4; READMODE = 1 (NRD controlled)
NWESETUP = 3; WRITEMODE = 1 (NWE controlled)
TDFCYCLES = 6; TDFMODE = 1 (optimization enabled).
When optimization is disabled, data float wait states are inserted at the end of the read transfer,
so that the data float period is ended when the second access begins. If the hold period of the
read1 controlling signal overlaps the data float period, no additional data float wait states will be
inserted.
Figure 15-22 on page
the cases:
• read access followed by a read access on another chip select.
• read access followed by a write access on another chip select.
NRDHOLD = 4
198,
TDFCYCLES = 6
shows a read access controlled by NRD, followed by a write access
Figure 15-23 on page 198
Read to Write
Wait State
NWESETUP = 3
Write access on NCS0 (NWE controlled)
and
Figure 15-24 on page 199
AT32UC3A3/A4
illustrate
Page

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