DF2134AFA20V Renesas Electronics America, DF2134AFA20V Datasheet - Page 55
![IC H8S/2100 MCU FLASH 80QFP](/photos/12/21/122132/df2134afa20v_sml.jpg)
DF2134AFA20V
Manufacturer Part Number
DF2134AFA20V
Description
IC H8S/2100 MCU FLASH 80QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheets
1.HEWH8E10A.pdf
(19 pages)
2.D12312SVTE25V.pdf
(341 pages)
3.DF2134AFA20V.pdf
(1063 pages)
Specifications of DF2134AFA20V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
IrDA, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
58
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
80-QFP
For Use With
3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF2134AFA20V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Table 25.25 A/D Conversion Characteristics
Table 25.26 D/A Conversion Characteristics ............................................................................. 755
Table 25.27 Flash Memory Characteristics (Programming/Erasing Operating Range) ............. 756
Table 25.28 Absolute Maximum Ratings................................................................................... 759
Table 25.29 DC Characteristics (1) ............................................................................................ 760
Table 25.29 DC Characteristics (2) ............................................................................................ 762
Table 25.29 DC Characteristics (3) ............................................................................................ 765
Table 25.30 Permissible Output Currents .................................................................................. 768
Table 25.31 Clock Timing ......................................................................................................... 769
Table 25.32 Control Signal Timing............................................................................................ 770
Table 25.33 Bus Timing............................................................................................................. 771
Table 25.34 Timing of On-Chip Supporting Modules ............................................................... 773
Table 25.35 A/D Conversion Characteristics
Table 25.36 A/D Conversion Characteristics
Table 25.37 D/A Conversion Characteristics ............................................................................. 777
Table 25.38 Flash Memory Characteristics................................................................................ 778
Table 25.39 Absolute Maximum Ratings................................................................................... 780
Table 25.40 DC Characteristics (1) ............................................................................................ 781
Table 25.40 DC Characteristics (2) ............................................................................................ 783
Table 25.40 DC Characteristics (3) ............................................................................................ 785
Table 25.41 Permissible Output Currents .................................................................................. 787
Table 25.42 Clock Timing ......................................................................................................... 788
Table 25.43 Control Signal Timing............................................................................................ 789
Table 25.44 Bus Timing............................................................................................................. 790
Table 25.45 Timing of On-Chip Supporting Modules ............................................................... 792
Table 25.46 A/D Conversion Characteristics
Table 25.47 A/D Conversion Characteristics
Table 25.48 D/A Conversion Characteristics ............................................................................. 796
Table 25.49 Flash Memory Characteristics (Programming/Erasing Operating Range) ............. 797
Appendix A Instruction Set
Table A.1
Table A.2
Table A.3
Table A.3
Table A.3
(CIN7 to CIN0 Input: 134/266-State Conversion) ................................................. 754
(AN7 to AN0 Input: 134/266-State Conversion) ................................................... 775
(CIN7 to CIN0 Input: 134/266-State Conversion) ................................................. 776
(AN7 to AN0 Input: 134/266-State Conversion) ................................................... 794
(CIN7 to CIN0 Input: 134/266-State Conversion) ................................................. 795
Instruction Set ........................................................................................................ 815
Instruction Codes.................................................................................................... 831
Operation Code Map (1) ........................................................................................ 845
Operation Code Map (2) ........................................................................................ 846
Operation Code Map (3) ........................................................................................ 847
Rev. 4.00 Jun 06, 2006 page liii of liv
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