DF2134AFA20V Renesas Electronics America, DF2134AFA20V Datasheet - Page 55

• Manufacturer Part Number: DF2134AFA20V
• Description: IC H8S/2100 MCU FLASH 80QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2134AFA20V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: IrDA, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 58
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 80-QFP
• For Use With: 3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 25.25 A/D Conversion Characteristics
Table 25.26 D/A Conversion Characteristics ............................................................................. 755
Table 25.27 Flash Memory Characteristics (Programming/Erasing Operating Range) ............. 756
Table 25.28 Absolute Maximum Ratings................................................................................... 759
Table 25.29 DC Characteristics (1) ............................................................................................ 760
Table 25.29 DC Characteristics (2) ............................................................................................ 762
Table 25.29 DC Characteristics (3) ............................................................................................ 765
Table 25.30 Permissible Output Currents .................................................................................. 768
Table 25.31 Clock Timing ......................................................................................................... 769
Table 25.32 Control Signal Timing............................................................................................ 770
Table 25.33 Bus Timing............................................................................................................. 771
Table 25.34 Timing of On-Chip Supporting Modules ............................................................... 773
Table 25.35 A/D Conversion Characteristics
Table 25.36 A/D Conversion Characteristics
Table 25.37 D/A Conversion Characteristics ............................................................................. 777
Table 25.38 Flash Memory Characteristics................................................................................ 778
Table 25.39 Absolute Maximum Ratings................................................................................... 780
Table 25.40 DC Characteristics (1) ............................................................................................ 781
Table 25.40 DC Characteristics (2) ............................................................................................ 783
Table 25.40 DC Characteristics (3) ............................................................................................ 785
Table 25.41 Permissible Output Currents .................................................................................. 787
Table 25.42 Clock Timing ......................................................................................................... 788
Table 25.43 Control Signal Timing............................................................................................ 789
Table 25.44 Bus Timing............................................................................................................. 790
Table 25.45 Timing of On-Chip Supporting Modules ............................................................... 792
Table 25.46 A/D Conversion Characteristics
Table 25.47 A/D Conversion Characteristics
Table 25.48 D/A Conversion Characteristics ............................................................................. 796
Table 25.49 Flash Memory Characteristics (Programming/Erasing Operating Range) ............. 797
Appendix A Instruction Set
Table A.1
Table A.2
Table A.3
Table A.3
Table A.3
(CIN7 to CIN0 Input: 134/266-State Conversion) ................................................. 754
(AN7 to AN0 Input: 134/266-State Conversion) ................................................... 775
(CIN7 to CIN0 Input: 134/266-State Conversion) ................................................. 776
(AN7 to AN0 Input: 134/266-State Conversion) ................................................... 794
(CIN7 to CIN0 Input: 134/266-State Conversion) ................................................. 795
Instruction Set ........................................................................................................ 815
Instruction Codes.................................................................................................... 831
Operation Code Map (1) ........................................................................................ 845
Operation Code Map (2) ........................................................................................ 846
Operation Code Map (3) ........................................................................................ 847
Rev. 4.00 Jun 06, 2006 page liii of liv