DF2134AFA20V Renesas Electronics America, DF2134AFA20V Datasheet - Page 53

• Manufacturer Part Number: DF2134AFA20V
• Description: IC H8S/2100 MCU FLASH 80QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2134AFA20V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: IrDA, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 58
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 80-QFP
• For Use With: 3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 21.20 Status Polling Output Truth Table.......................................................................... 620
Table 21.21 Command Wait State Transition Time Specifications ........................................... 620
Table 21.22 Registers Present in F-ZTAT Version but Absent in Mask ROM Version ............ 622
Section 22 ROM (H8S/2138 F-ZTAT A-Mask Version,
Table 22.1
Table 22.2
Table 22.3
Table 22.4
Table 22.5
Table 22.6
Table 22.7
Table 22.8
Table 22.9
Table 22.10 Programmer Mode Pin Settings ............................................................................. 655
Table 22.11 Settings for Each Operating Mode in Programmer Mode ...................................... 657
Table 22.12 Programmer Mode Commands .............................................................................. 657
Table 22.13 AC Characteristics in Memory Read Mode ........................................................... 658
Table 22.14 AC Characteristics when Entering Another Mode from Memory Read Mode ...... 659
Table 22.15 AC Characteristics in Memory Read Mode ........................................................... 660
Table 22.16 AC Characteristics in Auto-Program Mode ........................................................... 661
Table 22.17 AC Characteristics in Auto-Erase Mode ................................................................ 663
Table 22.18 AC Characteristics in Status Read Mode ............................................................... 664
Table 22.19 Status Read Mode Return Commands.................................................................... 665
Table 22.20 Status Polling Output Truth Table.......................................................................... 666
Table 22.21 Command Wait State Transition Time Specifications ........................................... 666
Table 22.22 Registers Present in F-ZTAT Version but Absent in Mask ROM Version ............ 668
Section 23 Clock Pulse Generator
Table 23.1
Table 23.2
Table 23.3
Table 23.4
Table 23.5
Table 23.6
Section 24 Power-Down State
Table 24.1
Table 24.2
H8S/2134 F-ZTAT A-Mask Version)
ROM Register ........................................................................................................ 624
Operating Modes and ROM ................................................................................... 625
Flash Memory Pins................................................................................................. 632
Flash Memory Registers......................................................................................... 632
Flash Memory Erase Blocks................................................................................... 638
Setting On-Board Programming Modes................................................................. 639
System Clock Frequencies for which Automatic Adjustment of the Chip's Bit
Rate Is Possible ...................................................................................................... 642
Hardware Protection............................................................................................... 651
Software Protection ................................................................................................ 652
CPG Registers ........................................................................................................ 670
Damping Resistance Value .................................................................................... 672
Crystal Resonator Parameters ................................................................................ 673
External Clock Input Conditions ............................................................................ 675
External Clock Output Settling Delay Time........................................................... 676
Subclock Input Conditions ..................................................................................... 677
H8S/2138 Group and H8S/2134 Group Internal States in Each Mode .................. 682
Power-Down Mode Transition Conditions............................................................. 684
Rev. 4.00 Jun 06, 2006 page li of liv