UPD78F1174AGF-GAT-AX Renesas Electronics America, UPD78F1174AGF-GAT-AX Datasheet - Page 960

• Manufacturer Part Number: UPD78F1174AGF-GAT-AX
• Description: MCU 16BIT 78K0R/KX3 128-LQFP
• Manufacturer: Renesas Electronics America
• Series: 78K0R/Kx3r

Specifications of UPD78F1174AGF-GAT-AX

• Core Processor: 78K/0R
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: 3-Wire SIO, EBI/EMI, I²C, LIN, UART/USART
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 111
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

958
2nd edition
Edition
DC Characteristics
• Addition of duty and Notes 2 and change of conditions in Output current, high (I
• Change of conditions in Output current, high (I
• Addition of duty and Notes 2 and change of conditions and MAX. value in Output
current, high (I
• Change of conditions in Output current, low (I
• Change of Input voltage, high (V
• Change of conditions in Input voltage, high (V
• Change of conditions in Input voltage, high (V
• Change of Cautions 2
• Change of Input voltage, low (V
• Change of conditions of Input voltage, low (V
• Change of conditions of Input voltage, low (V
• Change of conditions in Output voltage, high (V
• Change of Output voltage, high (V
• Change of conditions in Output voltage, low (V
• Change of conditions in Output voltage, low (V
• Change of conditions of Input leakage current, high (I
• Change of conditions of Input leakage current, high (I
• Change of conditions of Input leakage current, low (I
• Change of conditions of Input leakage current, low (I
• Change of Pill-up resistance value and Pill-down resistance value
• Addition of FLMD0 pin external pull-down resistance (R
• Addition of Supply current and operating current of macros
AC Characteristics
(1) Basic operation
• Change of Instruction cycle (minimum instruction execution time) (T
• Change of MAX. value in External main system clock input high-level width, low-level
width (t
• Change of MIN. value in TI00 to TI07 and TI10 to TI13 input high-level width, low-level
• Change of Remarks 1, 2
• Addition of figures of Minimum instruction execution time during main system
• Change of title in AC Timing Test Points
Addition of (2) External bus interface
Addition of (3) Serial interface: Serial array unit
Addition of (4) Serial interface: IIC0
Addition of (5) Serial interface: On-chip debug (UART)
Modification of condition in upper part of table of A/D Converter Characteristics
Change of A/D Converter Characteristics
Addition of Detection delay time to POC Circuit Characteristics
Change of Supply Voltage Rise Time
clock operation and Minimum instruction execution time during self
programming mode in (1) Basic operation
width (t
EXH
TIH
, t
, t
EXL
TIL
OL1
)
)
)
APPENDIX C REVISION HISTORY
IL3
IH3
User’s Manual U18432EJ5V0UD
)
OH2
)
Description
)
IL4
IL5
OL2
IH4
IH5
OH2
OL1
OL2
)
)
OH1
)
)
)
)
)
)
)
LIL2
LIL3
LIH2
LIH3
)
)
FLMD0
)
)
) and Note
CY
)
OH1
)
CHAPTER 29
ELECTRICAL
SPECIFICATIONS
(TARGET)
Chapter
(6/13)