mcf5272 Freescale Semiconductor, Inc, mcf5272 Datasheet - Page 494

• Manufacturer Part Number: mcf5272
• Description: Mcf5272 Coldfire Integrated Microprocessor User
• Manufacturer: Freescale Semiconductor, Inc

196X
Package Dimensions
22.2 Package Dimensions
Figure 22-2 shows MCF5272 package dimensions.
13X
22-2
3
e
X
E
Y
b
0.30
0.10 Z
S
0.20
Figure 22-2. 196 MAPBGA Package Dimensions (Case No. 1128A-01)
Z
14 13 12 11
X
Y
Laser mark for pin 1
identification in
this area
10
9
View M-m
D
6
13X
S
5
e
4
3
MCF5272 User’s Manual
2
1
A
B
C
D
E
F
G
H
K
L
M
N
P
J
Metalized mark for
pin 1 identification
in this area
K
M
M
A
A2
A1
Rotated 90 Clockwise
NOTES:
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances
3. Dimension B is measured at the
4. Datum Z (seating plane) is defined
5. Parallelism measurement shall
per ASME Y14.5M, 1994.
maximum solder ball diameter,
parallel to datum plane Z.
by the spherical crowns of the solder
balls.
exclude any effect of mark on top
surface of package.
Z
DIM Min
A1 0.27 0.47
A2
Detail K
A
b
D
E
e
S
°
4
1.32 1.75
0.35 0.65
Millimeters
15.00 BSC
15.00 BSC
1.18 REF
1.00 BSC
0.50 BSC
Max
0.15 Z
MOTOROLA
5
0.30 Z