HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 999

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Figures G.1 show the FP-100B package dimensions of the H8/3029. Figure G.2 shows the TFP-
100B package dimensions.
*Dimension including the plating thickness
Rev. 2.0, 06/04, page 970 of 980
Base material dimension
*0.22 ± 0.05
0.20 ± 0.04
100
76
1
75
Appendix G Package Dimensions
16.0 ± 0.3
Figure G.1 Package Dimensions (FP-100B)
0.10
14
0.08 M
1.0
51
25
26
50
Package Code
JEDEC
JEITA
Mass (reference value)
0.5 ± 0.2
1.0
FP-100B
—
Conforms
1.2 g
As of July, 2002
0
˚
– 8
˚
Unit: mm