HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 37

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

1.3
1.3.1
The pin arrangement of the H8/3029 FP-100B and TFP-100B packages is shown in figure 1.2.
Rev. 2.0, 06/04, page 8 of 980
TP
TP
Note: * When functioning as V
TP
TP
IRQ
2
3
0
1
TP
TP
TP
TP
/TIOCA
/TIOCB
/TCLKA/TEND
/TCLKB/TEND
3
4
5
6
7
Pin Description
Pin Arrangement
/CS
/TIOCA
/TIOCB
/TIOCA
/TIOCB
IRQ
IRQ
IRQ
1
AN
AN
0
0
/ADTRG/P8
/TCLKC/PA
/TCLKD/PA
0
/RFSH/P8
Figure 1.2 Pin Arrangement (FP-100B or TFP-100B, Top View)
6
7
1
2
1
1
2
2
/DA
/DA
/CS
/CS
AN
AN
AN
AN
AN
AN
CS
/A
/A
/A
/A
23
22
21
20
AV
0
1
2
3
4
5
0
1
3
2
0
0
1
V
AV
/P7
/P7
/P7
/P7
/P7
/P7
/P7
/P7
/P8
/P8
/P8
/PA
/PA
/PA
/PA
/PA
/PA
V
REF
CC
SS
SS
0
1
2
3
4
5
6
7
0
1
2
3
4
0
1
2
3
4
5
6
7
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
CL
pin, the connection of an external capacitor is required.
(FP-100B, TFP-100B)
Top view
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
0.1 F
1
P2
P2
P2
P2
P2
P2
V
P1
P1
P1
P1
P1
P1
P1
P1
V
P3
P3
P3
P3
P3
P3
P3
P3
P4
SS
CC
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/A
/D
/D
/D
/D
/D
/D
/D
/D
/D
13
12
11
10
9
8
7
6
5
4
3
2
1
0
15
14
13
12
11
10
9
8
7