HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 703

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Table 18.22 AC Characteristics Memory Read Mode
Condition : V
Code
Access time
CE output delay time
OE output delay time
Output disable delay time
Data output hold time
Rev. 2.0, 06/04, page 674 of 980
I/O7-0
A18-0
WE
CE
OE
I/O7-0
A18-0
WE
OE
CE
V
IH
V
V
V
CC
IH
IL
IL
= 3.0 V to 3.6 V, V
Address Stable
t
t
acc
acc
Address Stable
Figure 18.31 CE
t
t
t
t
Symbol
t
t
acc
ce
oe
df
oh
ce
Figure 18.32 CE
t
oe
SS
= 0 V, T
Min
5
t
oh
CE/OE
CE
CE
a
CE/OE
CE
CE
t
OE Enable State Read
OE
= 25°C ± 5°C
OE
oh
t
OE Clock Read
OE
OE
df
Max
20
150
150
100
t
acc
Address Stable
Address Stable
t
acc
Unit
µs
ns
ns
ns
ns
t
ce
t
oe
t
oh
Note
t
oh
t
df

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