HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 139

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
5.4.3
Table 5.5 indicates the interrupt response time from the occurrence of an interrupt request until
the first instruction of the interrupt service routine is executed.
Table 5.5
No.
1
2
3
4
5
6
Total
Notes: *1 1 state for internal interrupts.
Rev. 2.0, 06/04, page 110 of 980
Item
Interrupt priority
decision
Maximum number
of states until end of
current instruction
Saving PC and CCR
to stack
Vector fetch
Instruction prefetch*
Internal processing*
*2 Prefetch after the interrupt is accepted and prefetch of the first instruction in the
*3 Internal processing after the interrupt is accepted and internal processing after vector
*4 The number of states increases if wait states are inserted in external memory access.
*5 The examples of DIVXS.W Rs,ERd, MULXS.W Rs,ERd.
*6 The examples of MOV.L @(d:24,ERs), ERd, MOV.L ERs,@(d:24,ERd).
Interrupt Response Time
interrupt service routine.
fetch.
Interrupt Response Time
3
2
On-Chip
Memory
2*
1 to 23*
4
4
4
4
19 to 41
1
5
2 States
2*
1 to 27*
8
8
8
4
31 to 57
1
5,
8-Bit Bus
*
6
2*
1 to 41*
12*
12*
12*
4
43 to 83
3 States
1
4
4
4
External Memory
4,
*
6
2 States
2*
1 to 23*
4
4
4
4
19 to 41
1
16-Bit Bus
5
3 States
2*
1 to 25*
6*
6*
6*
4
25 to 49
1
4
4
4
4,
*
5

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