HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 462

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
11.3.2
If TPC output is enabled, NDRA/NDRB contents are transferred to PADR/PBDR and output
when the selected compare match event occurs. Figure 11.3 shows the timing of these operations
for the case of normal output in groups 2 and 3, triggered by compare match A.
Figure 11.3 Timing of Transfer of Next Data Register Contents and Output (Example)
Output Timing
TCNT
GRA
Compare
match A signal
NDRB
PBDR
TP to TP
8
15
m
m
N
N
n
N + 1
Rev. 2.0, 06/04, page 433 of 980
n
n

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