HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 766

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Item
CAS pulse width 1
CAS pulse width 2
CAS pulse width 3
RAS access time
Address access time
CAS access time
WE setup time
WE hold time
Write data setup time
WE write data hold time
CAS setup time 1
CAS setup time 2
CAS hold time
RAS pulse width
Signal rising time
(all input pins except for
EXTAL)
Signal falling time
(all input pins except for
EXTAL)
Note: In order to secure the address hold time relative to the rise of the RD strobe, address
update mode 2 should be used. For details see section 6.3.5, Address Output Method.
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
CAS1
CAS2
CAS3
RAC
AA
CAC
WCS
WCH
WDS
WDH
CSR1
CSR2
CHR
RAS
SR
SF
Min
1.5 t
1.0 t
1.0 t
—
—
—
0.5 t
0.5 t
0.5 t
0.5 t
0.5 t
0.5 t
0.5 t
1.5 t
—
—
cyc
cyc
cyc
cyc
cyc
cyc
cyc
cyc
cyc
cyc
cyc
– 20
– 20
– 20
– 20
– 15
– 20
– 15
– 20
– 15
– 15
– 15
Max
—
—
—
2.5 t
2.0 t
1.5 t
—
—
—
—
—
—
—
—
100
100
cyc
cyc
cyc
– 40
– 50
– 50
Rev. 2.0, 06/04, page 737 of 980
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Test
Conditions
Figure 21.19
to
Figure 21.21
Figure 21.30