HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 185

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

This is useful when inserting four or more T
different external devices.
The WAITE bit setting applies to all areas. Pin waits cannot be inserted in DRAM space.
Figure 6.17 shows an example of the timing for insertion of one program wait state in 3-state
space.
Rev. 2.0, 06/04, page 156 of 980
Read access
Write access
Figure 6.17 Example of Wait State Insertion Timing
Address bus
Note:
Data bus
Data bus
,
indicates the timing of
T
W
1
states, or when changing the number of T
Inserted
by program wait Inserted by
T
2
T
w
Write data
pin sampling.
T
w
T
w
Read data
pin
T
3
W
states for