HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 779

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Table 21.26 Bus Timing
Conditions: T
Item
Address delay time
Address hold time
Read strobe delay time
Address strobe delay
time
Write strobe delay time
Strobe delay time
Write strobe pulse
width 1
Write strobe pulse
width 2
Address setup time 1
Address setup time 2
Read data setup time
Read data hold time
Write data delay time
Write data setup time 1
Write data setup time 2
Write data hold time
Rev. 2.0, 06/04, page 750 of 980
V
fmax = 25 MHz
a
CC
= –20°C to +75°C (Standard characteristics specifications),
= 3.0 V to 3.6 V, AV
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
AD
AH
RSD
ASD
WSD
SD
WSW1
WSW2
AS1
AS2
RDS
RDH
WDD
WDS1
WDS2
WDH
CC
Min
0.5 t
1.0 t
1.5 t
0.5 t
1.0 t
25
0
1.0 t
2.0 t
0.5 t
= 3.0 V to 3.6 V, V
cyc
cyc
cyc
cyc
cyc
cyc
cyc
cyc
– 30
– 30
– 15
– 20
– 25
– 25
– 20
– 20
Max
25
25
25
25
25
35
REF
= 3.0 V to AV
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CC
, V
SS
= AV
Figure 21.13,
Figure 21.14,
Figure 21.16,
Figure 21.17,
Test
Conditions
Figure 21.19
SS
= 0 V,

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