HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 893

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
MAR0B R/E/H/L—Memory Address Register 0B R/E/H/L
Rev. 2.0, 06/04, page 864 of 980
Initial value
Read/Write
Initial value
Read/Write
Bit
Bit
R/W R/W R/W R/W R/W R/W
31
15
1
30
14
1
29
13
1
Undetermined
MAR0BR
MAR0BH
28
12
1
27
11
1
26
10
1
Source or destination address
R/W
25
1
9
R/W
24
8
1
R/W R/W R/W R/W R/W R/W
R/W R/W R/W R/W R/W R/W
23
7
22
6
H'FFF28 H'FFF29
H'FFF2A H'FFF2B
21
5
Undetermined
Undetermined
20
MAR0BE
MAR0BL
4
19
3
18
2
DMAC0
R/W
R/W
17
1
R/W
R/W
16
0

Related parts for HD64F3029XBL25V