HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 326

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Pin
PA
TIOCA
4
/TP
1
4
/
Pin Functions and Selection Method
Bit PWM1 in TMDR, bits IOA2 to IOA0 in TIOR1, bit NDER4 in NDERA, and bit PA
as follows.
16-bit timer channel 1
settings
PA
NDER4
Pin function
Note: * TIOCA
16-bit timer channel 1
settings
PWM1
IOA2
IOA1
IOA0
4
DDR
1
input when IOA2 = 1.
(2)
0
0
(1) in table below
TIOCA
0
0
1
1
output
(1)
0
1
PA
Rev. 2.0, 06/04, page 297 of 980
4
(2)
0
1
input
(2) in table below
4
TIOCA
DDR select the pin function
PA
4
output
1
0
1
input*
(1)
1
TP
4
output
1
1

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