HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 765

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Item
Read data access
time 1
Read data access
time 2
Read data access
time 3
Read data access
time 4
Precharge time 1
Precharge time 2
Wait setup time
Wait hold time
Bus request setup time
Bus acknowledge delay
time 1
Bus acknowledge delay
time 2
Bus-floating time
RAS precharge time
CAS precharge time
Low address hold time
RAS delay time 1
RAS delay time 2
CAS delay time 1
CAS delay time 2
WE delay time
Rev. 2.0, 06/04, page 736 of 980
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
ACC1
ACC2
ACC3
ACC4
PCH1
PCH2
WTS
WTH
BRQS
BACD1
BACD2
BZD
RP
CP
RAH
RAD1
RAD2
CASD1
CASD2
WCD
Min
—
—
—
—
1.0 t
0.5 t
25
5
25
—
—
—
1.5 t
0.5 t
0.5 t
—
—
—
—
—
cyc
cyc
cyc
cyc
cyc
– 20
– 20
– 25
– 15
– 15
Max
2.0 t
3.0 t
1.5 t
2.5 t
—
—
—
—
—
30
30
30
—
—
—
25
30
25
25
25
cyc
cyc
cyc
cyc
– 45
– 45
– 45
– 45
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Figure 21.13,
Figure 21.15
Figure 21.18
Figure 21.19,
Test
Conditions
Figure 21.14,
Figure 21.16,
Figure 21.17
Figure 21.20