HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 827

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Instruction Mnemonic
DEC
DIVXS
DIVXU
EEPMOV EEPMOV.B
EXTS
EXTU
INC
JMP
JSR
LDC
Rev. 2.0, 06/04, page 798 of 980
DEC.B Rd
DEC.W #1/2, Rd
DEC.L #1/2, ERd
DIVXS.B Rs, Rd
DIVXS.W Rs, ERd
DIVXU.B Rs, Rd
DIVXU.W Rs, ERd
EEPMOV.W
EXTS.W Rd
EXTS.L ERd
EXTU.W Rd
EXTU.L ERd
INC.B Rd
INC.W #1/2, Rd
INC.L #1/2, ERd
JMP @ERn
JMP @aa:24
JMP @@aa:8 Normal
JSR @ERn
JSR @aa:24 Normal
JSR @@aa:8 Normal
LDC #xx:8, CCR
LDC Rs, CCR
LDC @ERs, CCR
LDC @(d:16, ERs), CCR
LDC @(d:24, ERs), CCR
LDC @ERs+, CCR
LDC @aa:16, CCR
LDC @aa:24, CCR
Advanced 2
Normal
Advanced 2
Advanced 2
Advanced 2
Instruction
Fetch
I
1
1
1
2
2
1
1
2
2
1
1
1
1
1
1
1
2
2
2
2
2
2
1
1
2
3
5
2
3
4
Branch
Addr. Read
J
1
2
1
2
Stack
Operation
K
1
2
1
2
1
2
Byte Data
Access
L
2n + 2*
2n + 2*
1
1
Word Data
Access
M
1
1
1
1
1
1
Internal
Operation
N
12
20
12
20
2
2
2
2
2
2