HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 822

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
A.3
The tables in this section can be used to calculate the number of states required for instruction
execution by the H8/300H CPU. Table A.4 indicates the number of instruction fetch, data
read/write, and other cycles occurring in each instruction. Table A.3 indicates the number of states
required per cycle according to the bus size. The number of states required for execution of an
instruction can be calculated from these two tables as follows:
Number of states = I • S
Examples of Calculation of Number of States Required for Execution
Examples: Advanced mode, stack located in external address space, on-chip supporting modules
accessed with 8-bit bus width, external devices accessed in three states with one wait state and
16-bit bus width.
BSET #0, @FFFFC7:8
JSR @@30
From table A.4, I = L = 2 and J = K = M = N = 0
From table A.3, S
Number of states = 2
From table A.4, I = J = K = 2 and L = M = N = 0
From table A.3, S
Number of states = 2
Number of States Required for Execution
I
+ J • S
I
I
= 4 and S
= S
J
J
= S
4 + 2
4 + 2
+ K • S
K
= 4
L
= 3
K
3 = 14
4 + 2
+ L • S
4 = 24
L
+ M • S
M
+ N • S
Rev. 2.0, 06/04, page 793 of 980
N

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