HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 144

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
6.1.2
Figure 6.1 shows a block diagram of the bus controller.
Legend
ABWCR
ASTCR
WCRH
WCRL
BRCR
CSCR
DRCRA
DRCRB
RTMCSR
RTCNT
RTCOR
ADRCR
BCR
Internal address bus
CPU bus request signal
DMAC bus request signal
DRAM interface bus request signal
CPU bus acknowledge signal
DMAC bus acknowledge signal
DRAM interface bus acknowledge signal
Block Diagram
: Bus width control register
: Access state control register
: Wait control register H
: Wait control register L
: Bus release control register
: Chip select control register
: DRAM control register A
: DRAM control register B
: Refresh timer control/status register
: Refresh timer counter
: Refresh time constant register
: Address control register
: Bus control register
Internal signals
decoder
Figure 6.1 Block Diagram of Bus Controller
DRAM control
Area
control signals
Chip select
0
to
7
DRAM interface
Bus control
Wait state
controller
Bus arbiter
circuit
RTMCSR
ABWCR
DRCRA
DRCRB
RTCOR
ADRCR
RTCNT
ASTCR
WCRH
CSCR
WCRL
BRCR
BCR
Rev. 2.0, 06/04, page 115 of 980
Bus mode control signal
Bus size control signal
Access state control signal
Wait request signal
Internal signals

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