HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 723

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

19.3
The duty adjustment circuit adjusts the duty cycle of the clock signal from the oscillator to
generate .
19.4
The prescalers divide the system clock ( ) to generate internal clocks ( /2 to /4096).
19.5
The frequency divider divides the duty-adjusted clock signal to generate the system clock ( ). The
frequency division ratio can be changed dynamically by modifying the value in DIVCR, as
described below. Power consumption in the chip is reduced in almost direct proportion to the
frequency division ratio. The system clock generated by the frequency divider can be output at the
Rev. 2.0, 06/04, page 694 of 980
pin.
V
56*;
EXTAL
external)
4-5
CC
(internal or
Duty Adjustment Circuit
Prescalers
Frequency Divider
V
IH
Figure 19.7 External Clock Output Settling Delay Timing
t
DEXT