HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 783

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Module Item
SCI
DMAC
Rev. 2.0, 06/04, page 754 of 980
H8/3029F-ZTAT
output pin
Input
clock
cycle
Input clock rise
time
Input clock fall
time
Input clock
pulse width
Transmit data
delay time
Receive data
setup time
(synchronous)
Receive
data hold
time (syn-
chronous)
TEND delay time 1 t
TEND delay time 2 t
DREQ setup time
DREQ hold time
Asyn-
chronous
Syn-
chronous
Clock
input
Clock
output
C
Symbol
t
t
t
t
t
t
t
t
t
Scyc
SCKr
SCKf
SCKW
TXD
RXS
RXH
TED1
TED2
DRQS
DRQH
Figure 21.9 Output Load Circuit
R
H
Min
4
6
0.4
100
100
0
25
10
R
Max
1.5
1.5
0.6
100
50
50
L
C = 90 pF:
C = 30 pF: Ports 9, A, B
R = 2.4 k
R = 12 k
Input/output timing measurement
levels
• Low: Vcc
• High: Vcc
L
H
A
19
Unit
t
t
t
t
t
ns
ns
ns
ns
ns
ns
ns
ns
cyc
cyc
cyc
cyc
Scyc
to A
Ports 4, 6, 8
0
0.2 V
, D
0.7 V
15
to D
Test
Conditions
Figure 21.25
Figure 21.26
Figure 21.27,
Figure 21.28
Figure 21.29
8

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