HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 532

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Figure 13.15 shows a sample flowchart for initializing the SCI.
Set RIE, TIE, TEIE, MPIE, CKE1,
Clear TE and RE bits to 0 in SCR
<Start transmitting or receiving>
and CKE0 bits in SCR (leaving
Select communication format
Set RIE, TIE, TEIE, and MPIE
TE and RE bits cleared to 0)
Set TE or RE bit to 1 in SCR
1-bit interval elapsed?
Start of initialization
Set value in BRR
bits as necessary
in SMR
Yes
Figure 13.15 Sample Flowchart for SCI Initialization
Wait
No
(1)
(2)
(3)
(4)
(1)
(2)
(3)
(4)
Note: *
Set the clock source in SCR. Clear the RIE,
TIE, TEIE, MPIE, TE, and RE bits to 0.*
Select the communication format in SMR.
Write the value corresponding to the bit rate in
BRR.
This step is not necessary when an external
clock is used.
Wait for at least the interval required to transmit
or receive one bit, then set the TE or RE bit to
1 in SCR.* Set the RIE, TIE, TEIE, and MPIE
bits as necessary. Setting the TE or RE bit
enables the SCI to use the TxD or RxD pin.
In simultaneous transmitting and receiving,
the TE and RE bits should be cleared to 0 or
set to 1 simultaneously.
Rev. 2.0, 06/04, page 503 of 980

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