HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 706

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 18.25 AC Characteristics Status Read Mode
Condition : V
Code
Command write cycle
CE hold time
CE setup time
Data hold time
Data setup time
Programming pulse width
OE output delay time
Disable delay time
CE output delay time
WE rise time
WE fall time
Table 18.26 Stipulated Transition Times to Command Wait State
Condition : V
Code
Standby release
(oscillation settling time)
PROM mode setup time
V
CC
hold time
I/O7-0
A18-0
Note: I/O3 and I/O2 are undefined.
WE
CE
OE
CC
CC
= 3.0 V to 3.6 V, V
= 3.0 V to 3.6 V, V
t
ces
tf
t
ds
t
wep
Figure 18.35 Timing in Status Read Mode
H'71
Symbol
t
t
t
t
t
t
t
t
t
t
t
Symbol
t
t
t
nxtc
ceh
ces
dh
ds
wep
oe
df
ce
r
f
osc1
bmv
dwn
t
tr
ceh
t
dh
SS
t
SS
nxtc
= 0 V, T
= 0 V, T
t
ces
tf
Min
20
0
0
50
50
70
Min
30
10
0
t
ds
t
wep
a
a
= 25°C ± 5°C
= 25°C ± 5°C
H'71
t
tr
ceh
t
dh
Max
150
100
150
30
30
Max
t
nxtc
t
ce
Rev. 2.0, 06/04, page 677 of 980
t
Unit
µs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Unit
ms
ms
ms
oe
Note
Note
t
df
t
nxtc