HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 249

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

The transfer count is specified as a 16-bit value in ETCR. The ETCR value is decremented by 1 at
each transfer. When the ETCR value reaches H'0000, the DTE bit is cleared and the transfer ends.
If the DTIE bit is set to 1, a CPU interrupt is requested at this time. The maximum transfer count
is 65,536, obtained by setting ETCR to H'0000.
Transfers can be requested (activated) by compare match/input capture A interrupts from 16-bit
timer channels 0 to 2, transmit-data-empty and receive-data-full interrupts from SCI channel 0,
conversion-end interrupts from the A/D converter, and external request signals.
For the detailed settings see section 7.2.4, Data Transfer Control Registers (DTCR).
Rev. 2.0, 06/04, page 220 of 980
Legend
L = initial setting of MAR
N = initial setting of ETCR
Address T = L
Address B = L + (–1)
Address T
Address B
DTID
(2
Figure 7.2 Operation in I/O Mode
DTSZ
N – 1)
1 byte or word is
transferred per request
Transfer
IOAR