HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 338

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Pin
PB
TMIO
DREQ
PB
TMO
1
0
/TP
/TP
0
1
/CS
/
0
9
/CS
8
/
/
7
6
Pin Functions and Selection Method
Bits OIS3/2 and OS1/0 in 8TCSR1, bits CCLR1 and CCLR0 in TCR1, bit CS6E in CSCR, bit NDER9 in
NDERB, and bit PB
Notes:
Bits OIS3/2 and OS1/0 in 8TCSR0, bit CS7E in CSCR, bit NDER8 in NDERB, and bit PB
function as follows.
OIS3/2 and OS1/0
CS7E
PB
NDER8
Pin function
OIS3/2 and OS1/0
0
DDR
Pin function
PB
NDER9
CS6E
*1 TMIO
*2 When an external request is specified as a DMAC activation source, DREQ
1
DDR
bits OIS3/2 and OS1/0, bits CCLR1/0, bit CS6E, bit NDER9, and bit PB
1
DDR select the pin function as follows.
1
input when CCLR1 = CCLR0 = 1.
PB
input
PB
0
0
0
input
1
PB
output
0
PB
output
1
0
1
0
0
0
1
All 0
All 0
DREQ
TMIO
TP
output
8
TP
1
output
1
1
0
1
1
input*
input*
9
Rev. 2.0, 06/04, page 309 of 980
1
2
CS
output
7
CS
output
1
1
1
6
DDR.
0
DDR select the pin
0
input regardless of
TMIO
TMO
Not all 0
Not all 0
0
1
output
output

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