HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 929

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

NDERB—Next Data Enable Register B
NDERA—Next Data Enable Register A
Rev. 2.0, 06/04, page 900 of 980
Initial value
Read/Write
Initial value
Read/Write
Bit
Bit
NDER15
NDER7
R/W
R/W
7
0
7
0
NDER14
NDER6
R/W
R/W
Bits 7 to 0
Bits 7 to 0
NDER7
to NDER0
NDER15
to NDER8
6
0
6
0
0
1
0
1
NDER13
NDER5
R/W
R/W
5
0
5
0
TPC outputs TP
(NDR15 to NDR8 are not transferred to PB
TPC outputs TP
(NDR15 to NDR8 are transferred to PB
TPC outputs TP
TPC outputs TP
(NDR7 to NDR0 are not transferred to PA
(NDR7 to NDR0 are transferred to PA
Next data enable 15 to 8
Next data enable 7 to 0
NDER12
NDER4
R/W
R/W
4
0
4
0
15
15
7
7
to TP
to TP
to TP
to TP
NDER11
NDER3
Description
Description
R/W
R/W
3
0
3
0
0
0
8
8
are disabled
are enabled
are disabled
are enabled
H'FFFA2
H'FFFA3
NDER10
NDER2
R/W
R/W
2
0
2
0
7
7
to PA
to PB
7
7
to PA
to PB
NDER9
NDER1
0
0
)
R/W
R/W
)
1
0
1
0
0
0
)
)
TPC
TPC
NDER8
NDER0
R/W
R/W
0
0
0
0