HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 784

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

21.3.4
Table 21.28 lists the A/D conversion characteristics.
Table 21.28 A/D Conversion Characteristics
Conditions: T
Item
Conver-
sion time:
134 states
Item
Conver-
sion time*:
70 states
Note:
* When using an operating frequency above f = 70 (state) /5.38 (µs) = 13.0 (MHz), do not
A/D Conversion Characteristics
select 70-state conversion time.
Resolution
Conversion time (single
mode)
Analog input capacitance
Permissible signal-source
impedance
Nonlinearity error
Offset error
Full-scale error
Quantization error
Absolute accuracy
Resolution
Conversion time (single
mode)
Analog input capacitance
Permissible signal-source
impedance
Nonlinearity error
Offset error
Full-scale error
Quantization error
Absolute accuracy
V
fmax = 25 MHz
a
CC
= –20°C to +75°C (Standard characteristics specifications),
= 3.0 V to 3.6 V, AV
CC
= 3.0 V to 3.6 V, V
—
—
Min
10
5.36
—
—
—
—
—
—
Min
10
5.38
—
—
—
—
—
—
Typ
10
—
—
—
—
—
—
—
—
Typ
10
—
—
—
—
—
—
—
—
REF
= 3.0 V to AV
Rev. 2.0, 06/04, page 755 of 980
Max
10
—
20
5
±3.5
±3.5
±3.5
±0.5
±4.0
Max
10
—
20
5
±7.5
±7.5
±7.5
±0.5
±8.0
CC
, V
SS
Unit
bits
µs
pF
k
LSB
LSB
LSB
LSB
LSB
Unit
bits
µs
pF
k
LSB
LSB
LSB
LSB
LSB
= AV
SS
= 0 V,