HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 118

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Bit 3—User Bit Enable (UE): Selects whether to use the UI bit in CCR as a user bit or an
interrupt mask bit.
Bit 3
UE
0
1
Bit 2—NMI Edge Select (NMIEG): Selects the NMI input edge.
Bit 2
NMIEG
0
1
5.2.2
IPRA and IPRB are 8-bit readable/writable registers that control interrupt priority.
Interrupt Priority Registers A and B (IPRA, IPRB)
Description
UI bit in CCR is used as interrupt mask bit
UI bit in CCR is used as user bit
Description
Interrupt is requested at falling edge of NMI input
Interrupt is requested at rising edge of NMI input
Rev. 2.0, 06/04, page 89 of 980
(Initial value)
(Initial value)

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