HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 790

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
A
CS
RD
(read)
D
(read)
HWR, LWR
(write)
D
(write)
Note:
AS
23
15
15
n
to A
to D
to D
*
0
0
0
,
Specification from the earliest negation timing of A
t
AD
t
CH
Figure 21.13 Basic Bus Cycle: two State Access
t
t
t
AS1
AS1
AS1
t
T
cyc
t
1
t
t
t
WDD
ASD
ASD
ASD
t
ACC1
t
Cf
t
CL
t
cyc
t
t
ACC3
ACC3
t
t
WSW1
WDS1
t
Cr
23
to A
T
0
2
,
t
t
SD
+5
SD
t
RDS
n
, and
Rev. 2.0, 06/04, page 761 of 980
t
AH
t
t
AH
WDH
4,
.
t
RSD
t
RDH
t
t
PCH1
PCH1
*
t
PCH2

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