HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 842

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Address
(Low)
H'FFFC0
H'FFFC1
H'FFFC2
H'FFFC3
H'FFFC4
H'FFFC5
H'FFFC6
H'FFFC7
H'FFFC8
H'FFFC9
H'FFFCA
H'FFFCB
H'FFFCC
H'FFFCD
H'FFFCE
H'FFFCF
H'FFFD0
H'FFFD1
H'FFFD2
H'FFFD3
H'FFFD4
H'FFFD5
H'FFFD6
H'FFFD7
H'FFFD8
H'FFFD9
H'FFFDA
H'FFFDB
H'FFFDC
H'FFFDD
H'FFFDE
H'FFFDF
Register
Name
SMR
BRR
SCR
TDR
SSR
RDR
SCMR
Reserved area (access prohibited)
P1DR
P2DR
P3DR
P4DR
P5DR
P6DR
P7DR
P8DR
P9DR
PADR
PBDR
Data
Bus
Width
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
Bit 7
C/A
TIE
P1
P2
P3
P4
P6
P7
PA
PB
TDRE
7
7
7
7
7
7
7
7
Bit 6
CHR
RIE
RDRF
P1
P2
P3
P4
P6
P7
PA
PB
6
6
6
6
6
6
6
6
Bit 5
PE
TE
ORER
P1
P2
P3
P4
P6
P7
P9
PA
PB
5
5
5
5
5
5
5
5
5
Bit 4
O/E
RE
FER/ER
S
P1
P2
P3
P4
P6
P7
P8
P9
PA
PB
4
4
4
4
4
4
4
4
4
4
Bit Names
Bit 3
STOP
MPIE
PER
SDIR
P1
P2
P3
P4
P5
P6
P7
P8
P9
PA
PB
3
3
3
3
3
3
3
3
3
3
3
Bit 2
MP
TEIE
TEND
SINV
P1
P2
P3
P4
P5
P6
P7
P8
P9
PA
PB
2
2
2
2
2
2
2
2
2
2
2
Rev. 2.0, 06/04, page 813 of 980
Bit 1
CKS1
CKE1
MPB
P1
P2
P3
P4
P5
P6
P7
P8
P9
PA
PB
1
1
1
1
1
1
1
1
1
1
1
Bit 0
CKS0
CKE0
MPBT
SMIF
P1
P2
P3
P4
P5
P6
P7
P8
P9
PA
PB
0
0
0
0
0
0
0
0
0
0
0
Module
Name
SCI
channel 2
Port 1
Port 2
Port 3
Port 4
Port 5
Port 6
Port 7
Port 8
Port 9
Port A
Port B

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