HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 60

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
2.6.2
Table 2.2 indicates the instructions available in the H8/300H CPU.
Table 2.2
Function
Data
transfer
Arithmetic
operations
Logic
operations
Shift instructions
Bit manipulation
Branch
System
control
Block data transfer
Instruction
MOV
POP, PUSH
MOVFPE,
MOVTPE
ADD, CMP
SUB
ADDX, SUBX
ADDS, SUBS
INC, DEC
DAA, DAS
MULXU,
MULXS,
DIVXU,
DIVXS
NEG
EXTU, EXTS
AND, OR, XOR —
NOT
Bcc, BSR
JMP, JSR
RTS
TRAPA
RTE
SLEEP
LDC
STC
ANDC, ORC,
XORC
NOP
Instructions and Addressing Modes
Instructions and Addressing Modes
#xx
BWL
BWL
WL
B
B
B
B
Rn
BWL
BWL
BWL
B
L
BWL
B
BW
BWL
WL
BWL
BWL
BWL
B
B
@ERn
BWL
B
W
W
@
(d:16,
ERn)
BWL
W
W
@
(d:24,
ERn)
BWL
W
W
@ERn+/
@–ERn
BWL
W
W
Addressing Modes
@
aa:8
B
B
@
aa:16
BWL
W
W
Rev. 2.0, 06/04, page 31 of 980
@
aa:24
BWL
W
W
@
(d:8,
PC)
@
(d:16,
PC)
@@
aa:8
WL
BW

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