HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 986

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
WPBD:
WPB:
RPB:
PB
7
Write to PBDDR
Write to port B
Read port B
Figure C.11 (h) Port B Block Diagram (Pin PB
Hardware standby
Q
Q
PB DDR
PB DR
WPBD
RPB
7
Reset
Reset
C
C
7
R
R
D
D
Rev. 2.0, 06/04, page 957 of 980
WPB
7
)
SCI
Input enable
TPC
TPC
output
enable
Next data
Output
trigger
SCI
Serial receive
data

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