HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 702

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Table 18.21 AC Characteristics in Transition from Memory Read Mode to Others
Condition : V
Code
Command write cycle
CE hold time
CE setup time
Data hold time
Data setup time
Programming pulse width
WE rise time
WE fall time
I/O7-0
A18-0
Figure 18.30 Timing at Transition from Memory Read Mode to Other Modes
WE
OE
CE
Note :
CC
= 3.0 V to 3.6 V, V
WE
and
Memory Read Mode
OE
Address Stable
Symbol
t
t
t
t
t
t
t
t
nxtc
ceh
ces
dh
ds
wep
r
f
should not be enabled simultaneously.
SS
= 0 V, T
Min
20
0
0
50
50
70
a
= 25°C ± 5°C
Max
30
30
t
nxtc
Other Mode Command Write
Unit
µs
ns
ns
ns
ns
ns
ns
ns
t
ces
tf
Rev. 2.0, 06/04, page 673 of 980
Note
t
wep
t
ds
t
ceh
tr
t
dh

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