HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 542

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

From equation (1), if F = 0 and D = 0.5, the receive margin is 46.875%, as given by equation (2).
This is a theoretical value. A reasonable margin to allow in system designs is 20% to 30%.
Restrictions on Use of DMAC:
Note: In operation with an external clock source, be sure that t >4 states.
SCK
TDRE
When an external clock source is used for the serial clock, after the DMAC updates TDR,
allow an inversion of at least five system clock ( ) cycles before input of the serial clock to
start transmitting. If the serial clock is input within four states of the TDR update, a
malfunction may occur (see figure 13.22) .
To have the DMAC read RDR, be sure to select the corresponding SCI receive-data-full
interrupt (RXI) as the activation source with bits DTS2 to DTS0 in DTCR.
D = 0.5, F = 0
M =
= 46.875%
Figure 13.22 Example of Synchronous Transmission Using DMAC
(0.5
t
–
D0
2
1
16
D1
)
100%
D2
D3
D4
Rev. 2.0, 06/04, page 513 of 980
D5
. . . . . . . . (2)
D6
D7